The Pro-Form Kft. develops packaging materials with high heat resistance.
Pro-Form develops high heat resistance packaging
The Budapest University of Technology and Economics (BME) is also participating in the development as a consortium partner. According to the announcement, the members of the consortium received a non-refundable grant of 642.49 million HUF from the Plus source of the Economic Development and Innovation Operational Program (Ginop) for the creation of a prototype of the new product. (MTI)
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