Henkel liquid thermal gap filler accelerates dispensing, reduces contamination risk and improves reliability

Historically, to overcome the processing difficulties of highly-filled liquid TIM products, material developers have integrated low molecular weight binders to reduce viscosity in an effort to accelerate dispense rates. However, this practice can result in the production of mobilized volatiles that interfere with mechanical contacts, optical components and sensitive environments. Therefore, Henkel’s novel silicone-based resin chemistry and filler approach are significant, particularly for mass production, volatile-susceptible applications such as industrial automation and power conversion, automotive electronics, computers and peripherals and devices integrating optical components.

Bergquist Gap Filler TGF 4500CVO is a two-part, 4.50 W/m-K liquid thermal interface material with a unique polymer resin structure that, when combined with novel filler processing, dispenses quickly at a rate of up to 4.9 cc/second with no caking or separation. The slump-resistant liquid thoroughly fills gaps and complex topographies, reducing thermal resistance and imparting little to no assembly stress on substrates and component interconnects.  Containing less than 300 ppm volatile silicones, Bergquist Gap Filler TGF 4500CVO can be integrated into virtually any environment without fear of contamination or functional interference.

“Unless you are a chemist, it may be difficult to appreciate how ingenious the Bergquist Gap Filler TGF 4500CVO formulation is,” Kolbe concludes. “But the results speak for themselves:  easily processed, high throughput, high thermal conductivity, low risk, improved operational reliability and cost-competitive. For certain applications, this product delivers on all fronts.”